将烧结致密的(NbTaVWMo)C 块状样品,在尺寸为250*21*5mm的金刚石磨盘进行粗磨,粒度为220目,磨盘转速为300转/min, 载荷为60 N,用JSM-IT800型扫描电子显微镜对粗磨后工件表面形貌进行1000、5000和10000倍观察,扫描电压20 Kev,二次电子像。
The sintered dense (NbTaVWMo) C block sample was roughly ground on a diamond grinding disc with a size of 250 * 21 * 5mm, a particle size of 220 mesh, a grinding disc speed of 300 revolutions per minute, and a load of 60 N. The surface morphology of the workpiece after rough grinding was observed at 1000, 5000, and 10000 times using a JSM-IT800 scanning electron microscope, with a scanning voltage of 20 Kev and a secondary electron image.