根据任务书要求，项目针对我国高端制造业发展对电子元器件用高性能、高精度铜及铜合金板带箔材的紧迫需求，按照基础理论研究、关键共性技术开发、产业化成套技术开发、产品规模生产与应用开展研究。

According to the requirements of the mission statement, the project is aimed at the urgent demand for high-performance, high-precision copper and copper alloy plates, strips and foils for electronic components in the development of my country's high-end manufacturing industry. It is based on basic theoretical research, key common technology development, industrialization complete technology development。