本发明公开的一种综合性能优异的铜合金带材，其特征在于该铜合金的重量百分比组成包括：Ni：2.5wt％-4 .0wt％ ，Co：0.2wt％-1.2wt％，Si：0.4wt％-1.4wt％，Ag：0.01wt％-0.2wt％，余量为Cu。本发明综合性能优异的铜合金带材其屈服强度达850 MPa以上、弹性模量达120 GPa以上、导电率达45％ IACS以上，在具有高的屈服强度的同时，该板带材具有良好的折弯性能，Badway 90 °折弯R/t≤2.5不开裂(R为折弯半径、t为带材厚度)，是生产制造电子接插件、连接器、电子零部件与引线框架的理想材料。

The present invention discloses a copper alloy strip with excellent comprehensive performance, which is characterized in that the weight percentage composition of the copper alloy includes: Ni: 2.5 wt%-4.0 wt%, Co: 0.2 wt%-1.2 wt%, Si: 0.4 wt%-1.4 wt%, Ag: 0.01 wt%-0.2 wt%, and the balance is Cu. The copper alloy strip with excellent comprehensive performance of the present invention has a yield strength of more than 850 MPa, an elastic modulus of more than 120 GPa, and a conductivity of more than 45% IACS. While having high yield strength, the plate and strip have good bending properties. Performance, Badway 90 ° bending R/t≤2.5 does not crack (R is the bending radius, t is the thickness of the strip). It is an ideal material for the production of electronic connectors, connectors, electronic components and lead frames.