主要归纳了钨靶材主要的制备手段(以热等静压和热轧为主的各种热机械工艺的组合),并分析了各工艺路径的特点,最后预测了钨靶材制备技术的发展趋势,认为进一步控制钨靶材制备过程中的晶粒尺寸和降低钨薄膜的电阻率将成为未来重要的研究内容。
This paper mainly summarizes the main preparation methods of tungsten target (the combination of various thermomechanical processes dominated by hot isostatic pressing and hot rolling), analyzes the characteristics of each process path, and finally predicts the development trend of tungsten target preparation technology. It is considered that further controlling the grain size and reducing the resistivity of tungsten film will become important research contents in the future.