以高纯钨粉和钛粉为原料,通过真空热压烧结制备出钨钛合金板。钨钛合金板制备完成后,线切割取样10*10*T(避开边缘20mm),然后六面磨光,超声波清洗烘干后,双层真空包装,然后寄给相应的第三方检测机构进行平均晶粒尺寸的检测。
Tungsten titanium alloy plate was prepared by vacuum hot pressing sintering with high purity tungsten powder and titanium powder as raw materials. After the preparation of tungsten titanium alloy plate, 10 * 10 * t (20mm away from the edge) shall be sampled by wire cutting, and then polished on six sides. After ultrasonic cleaning and drying, it shall be packed in double-layer vacuum, and then sent to the corresponding third-party testing organization for testing the average grain size.