对通过对硅部件制品进行双面抛光，计算机模拟不同内外齿轮转速比时硅片上某一点相对抛光盘的运动轨迹，优化双面抛光工艺，然后用清洗机进行清洗干燥。

For the double-sided polishing of silicon parts, the computer simulates the movement trajectory of a certain point on the silicon wafer relative to the polishing disc at different internal and external gear speed ratios, optimizes the double-sided polishing process, and then uses a washing machine to clean and dry.