The microstructure evolution of high-purity tungsten (6N), ordinary-purity tungsten (5N) and doped tungsten (4N) during the deformation process is studied. The results show that the influence of impurity elements on the thermal deformation of tungsten is mainly reflected in the middle The dynamic recrystallization process. The specific performance is as follows: First, the pinning effect on grain boundaries and dislocations is strengthened, and the effect on the hot rolling of the material is mainly manifested in its slow dynamic recrystallization behavior, which changes the texture state under the subsequent large deformation variables; The second is to reduce the deformation difference between grains of different orientations, thereby improving the uniformity of the structure during the dynamic/static recrystallization process. However, such a uniform structure is not conducive to the formation of fiber grains in the later stage of rolling, and promotes the process of processing. The generation of microcracks.