一种光学装置，该光学装置包含LED芯片、吸光剂和/或可见光发光材料以及近红外发光材料，其中近红外发光材料、吸光剂和/或可见光发光材料在LED芯片激发下发射的650‑1000nm波段光功率为A，近红外和可见光发光材料在LED芯片激发下发射的350‑650nm波段光功率，以及LED芯片激发近红外和可见光发光材料后LED芯片在350‑650nm波段的残留发射光功率，两者之和为B，其中B/A*100％为0.1％‑10％。该光学装置利用LED芯片同时复合近红外发光材料、吸光剂和/或可见光发光材料的实现方式，用同一LED芯片同时实现近红外及可见光发光，且得到强的近红外发光和弱的可见光发光，具有无红爆的优势，且简化了封装工艺，降低了封装成本，具有发光效率高/可靠性能优异的特点。

The invention discloses an optical device. The optical device comprises an LED chip, a light absorbing agent and/or a visible light light-emitting material and a near-infrared light-emitting material,wherein the power of 650-1000nm waveband light emitted by the near-infrared light-emitting material, the light absorbing agent and/or the visible light light-emitting material under the excitation ofthe LED chip is A, the sum of the power of 350-650nm waveband light emitted by the near-infrared light-emitting material and the visible light light-emitting material under the excitation of the LEDchip and the power of residual emitted light of the LED chip on the 350-650nm waveband after the LED chip excites the near-infrared light-emitting material and the visible light light-emitting material is B, and B/A*100% is 0.1%-10%. According to the optical device, the LED chip is simultaneously compounded with the near-infrared light-emitting material, the light absorbing agent and/or the visible light light-emitting material, near-infrared light emitting and visible light emitting are achieved at the same time through the same LED chip, and strong near-infrared light emitting and weak visible light emitting are obtained. The optical device has the advantage of being free of red explosion, simplifies the packaging process, reduces the packaging cost, and has the characteristics of beinghigh in light emitting efficiency and excellent in reliability performance.