本发明公开了属于磁控溅射靶材制造技术领域的一种具有低热膨胀系数的背板及其制造方法。所述背板采用高热导Al或Cu金属粉末及低热膨胀的AlN粉末为原料,通过配料、混粉,再经压力烧结、机加工出靶材用背板。该背板热膨胀系数不大于10×10～(-6)K～(-1)、热导率不小于200W·m～(-1)·K～(-1)、直径相对密度大于99％,可以与低热膨胀的系列靶材实现高可靠性焊接复合。

The invention discloses a back plate with a low thermal expansion coefficient and a manufacturing method thereof, belonging to the technical field of magnetron sputtering target material manufacturing. The back plate adopts Al or Cu metal powder with high thermal conductivity and AlN powder with low thermal expansion as raw materials, and the back plate for the target material is formed by batching, powder mixing, pressure sintering and machining. The thermal expansion coefficient of the back plate is not more than 10×10～(-6)K～(-1), the thermal conductivity is not less than 200W·m～(-1)·K～(-1), the relative density of diameter is more than 99%, It can be combined with a series of targets with low thermal expansion to achieve high reliability welding.