本发明公开了一种硅环加工的工艺方法，包括以下步骤：(1)将硅环固定在卡盘上，先将目数较小的普通刀具固定在刀架上，开动机器，让卡盘和刀具旋转，将硅环外径去除0.5mm；(2)换一把目数较大的普通刀具将硅环外径去除0.3mm；(3)换上特殊刀具固定在刀架上，该特殊刀具具有圆柱部分和斜面部分，其中刀具的圆柱部分用来研磨硅环外径，刀具的斜面部分用来对硅环外径进行倒角，用刀具的圆柱部分研磨硅环外径到目标直径；然后用刀具的斜面部分先后倒角硅环外径的左边和右边；(4)将加工好的硅环进行双面研磨、加工中心做内径、定位孔及卡槽。采用本发明的工艺方法可以制造外径倒角质量非常高的硅环，硅环外径倒角一致性好，无崩边，无污染，无毒害。

The invention discloses a process method for processing a silicon ring, which includes the following steps: (1) Fix the silicon ring on a chuck, first fix an ordinary tool with a smaller mesh on the tool holder, start the machine, and let the chuck Rotate with the tool to remove the outer diameter of the silicon ring by 0.5mm; (2) Replace the ordinary tool with a larger mesh to remove the outer diameter of the silicon ring by 0.3mm; (3) Replace with a special tool and fix it on the tool holder. The tool has a cylindrical part and a beveled part. The cylindrical part of the tool is used to grind the outer diameter of the silicon ring, the beveled part of the tool is used to chamfer the outer diameter of the silicon ring, and the cylindrical part of the tool is used to grind the outer diameter of the silicon ring to the target diameter; Then use the bevel part of the tool to chamfer the left and right sides of the outer diameter of the silicon ring successively; (4) Carry out double-sided grinding of the processed silicon ring, and make the inner diameter, positioning hole and slot of the machining center. By adopting the process method of the present invention, a silicon ring with very high outer chamfering quality can be manufactured, and the outer chamfering consistency of the outer diameter of the silicon ring is good, there is no chipping, no pollution, and no toxicity.