本发明公开了一种用于加工硅环的方法，包括以下步骤：(1)将可以旋转的装置安装在加工中心作业平台上；将硅环固定在该装置上，并用加工中心对硅环进行定位；(2)调节旋转装置的自转速度，硅环随着装置进行旋转，使用加工中心对硅环的内外径、表面和异形部分进行机加工；(3)加工结束时，取下硅环进行清洗。本发明利用加工中心加工圆形硅环时使硅环进行自转，对硅环的外径和内径进行加工，可以通过旋转装置调整硅环的自转速度来达到所需要的内外径表面。本发明的方法简单易行，大大降低了外径表面处理时间，明显提高了硅环加工效率和质量。

The invention discloses a method for processing a silicon ring, which includes the following steps: (1) a device that can be rotated is installed on a working platform of a machining center; Positioning; (2) Adjust the rotation speed of the rotating device, the silicon ring rotates with the device, and use the machining center to machine the inner and outer diameter, surface and special-shaped parts of the silicon ring; (3) At the end of the processing, remove the silicon ring and proceed Clean. The invention uses the machining center to process the circular silicon ring to make the silicon ring rotate to process the outer and inner diameters of the silicon ring, and the rotation speed of the silicon ring can be adjusted by a rotating device to reach the required inner and outer diameter surface. The method of the invention is simple and easy to implement, greatly reduces the outer diameter surface treatment time, and obviously improves the processing efficiency and quality of the silicon ring.