本发明公开了一种用于硅环倒角的装置及方法，该装置包括刀柄、刀具和排屑口，排屑口位于刀具的底部，刀具具有内径磨削面和倒角磨削面，倒角磨削面与内径磨削面之间具有夹角。采用该装置进行硅环倒角的方法包括以下步骤：(1)硅环固定在装卡工装上，将切屑液连续喷到硅环上；(2)采用所述装置采用面对面的方式进行倒角的加工，调整刀具的转速和进刀量，实现所需硅环倒角形状和大小；(3)倒角完成后，进行超声清洗煮沸去除油污和表面碎渣。通过本发明的装置及方法加工硅环倒角，可以获得硅环倒角表面粗糙度的改善和加工效率的提升。

The invention discloses a device and a method for chamfering a silicon ring. The device comprises a tool holder, a tool and a chip removal port. The chip removal port is located at the bottom of the tool. The tool has an inner diameter grinding surface and a chamfering grinding surface. There is an included angle between the chamfer grinding surface and the inner diameter grinding surface. The method of using this device to chamfer a silicon ring includes the following steps: (1) The silicon ring is fixed on the clamping tool, and the cutting liquid is continuously sprayed onto the silicon ring; (2) The device is used for chamfering in a face-to-face manner For processing, adjust the speed and feed rate of the tool to achieve the desired shape and size of the silicon ring chamfer; (3) After the chamfer is completed, perform ultrasonic cleaning and boiling to remove oil stains and surface debris. By processing the silicon ring chamfer by the device and method of the present invention, the surface roughness of the silicon ring chamfer can be improved and the processing efficiency can be improved.