本发明公开了一种硅环加工的工艺。该工艺包括以下步骤：(1)将硅环依次进行外径研磨、双面研磨、加工中心做硅环一面上的内径和定位孔、加工中心做硅环另一面上的卡槽，其中加工中心做卡槽时，先用目数在10 1000目之间的刀具和对应的加工程序加工出卡槽，然后用目数在1000 3000目之间的刀具和对应的抛光程序抛光卡槽；(2)将机加工好的硅环依次进行腐蚀、双面抛光、清洗。采用本发明的工艺可以制造卡槽表面质量非常高的的硅环，硅环尺寸精度可控，省时省力，无污染，无毒害。

The invention discloses a process for processing a silicon ring. The process includes the following steps: (1) The silicon ring is subjected to outer diameter grinding and double-sided grinding in turn, the machining center is used as the inner diameter and positioning hole on one side of the silicon ring, and the machining center is used as a slot on the other side of the silicon ring, where the machining center. When making a card slot, first use a tool with a mesh number between 10 and 1000 mesh and the corresponding processing program to machine the card slot, and then use a tool with a mesh number between 1000 and 3000 mesh and the corresponding polishing program to polish the card slot; (2 ) The machined silicon ring is sequentially etched, polished and cleaned on both sides. By adopting the process of the present invention, a silicon ring with very high surface quality of the card groove can be manufactured, and the dimensional accuracy of the silicon ring is controllable, time-saving, labor-saving, pollution-free, and non-toxic.