本实用新型属于磁控溅射靶材制造技术领域,公开了一种高比面积的靶材组件,所述靶材组件包括靶材和支撑所述靶材的背板,所述背板有接触冷却水区域,该区域有数控铣床等机加工设备加工出的阿基米德螺旋线沟槽。所述背板接触冷却水区域的比表面积从100％增加到150％以上,通过增加背板上接触冷却水区域的表面积及水流导向,可实现对靶材溅射过程产生的热量快速导出,从而降低靶材表面温升,提高镀膜性能。

The utility model belongs to the technical field of magnetron sputtering target material manufacturing, and discloses a target material assembly with a high specific area. Cooling water area, this area has Archimedes spiral grooves processed by CNC milling machines and other machining equipment. The specific surface area of the cooling water area of the back plate is increased from 100% to more than 150%. By increasing the surface area and water flow direction of the cooling water area on the back plate, the heat generated during the sputtering process of the target can be quickly exported, thereby reduce the temperature rise of the target surface and improve the coating performance.