本发明属于铜合金材料技术领域，涉及一种基于微结构设计的高性能Cu-Ni-Si 合金的制备，该制备的工序为：非真空 HCCM 连铸→固溶→依次冷轧→不连续时效→二次冷轧→连续时效工艺，即得到微结构设计的高性能 Cu-Ni-Si合金。该制备能够发生连续析出和不连续析出转变的 Cu-Ni-Si 合金，通过，实现合金性能的综合优化。在冷轧和时效组合过程中，大大提升合金中析出相的数量和百分比例，提升合金的电导率；同时构造出不连续析出相+连续析出相的跨尺度组合，实现强化效率的提升，进而提高合金强度。本发明所述的方法，缩短了工艺流程、降低了生产成本、提高了生产效率，并进一步提升了材料的力电综合性能。

The present invention belongs to the field of copper alloy material technology, relates to the preparation of a high-performance Cu-Ni-Si alloy based on microstructure design, the preparation process is: non-vacuum HCCM continuous casting→ solid solution → sequential cold rolling→ discontinuous aging→ secondary cold rolling →continuous aging process, that is, obtaining a high-performance Cu-Ni-Si alloy with a microstructure design. In this process, Cu-Ni-Si alloys that can undergo continuous precipitation and discontinuous precipitation transitions are prepared, and the comprehensive optimization of alloy properties is realized. In the process of cold rolling and aging combination, the number and percentage of precipitated phases in the alloy are greatly increased, and the conductivity of the alloy is improved. At the same time, the cross-scale combination of discontinuous precipitated phase + continuous precipitated phase is constructed to improve the strengthening efficiency and improve the strength of the alloy. The method described in the present invention shortens the process flow, reduces production costs, improves production efficiency, and further improves the comprehensive electromechanical properties of the material.