本发明公开了一种环氧树脂封装胶，包括A组分和B组分；所述A组分包括如下组分：环氧树脂、抗氧剂、促进剂A、填料和改性层状硅酸盐；所述B组分包括如下组分：酸酐、促进剂B和偶联剂；优选所述A组分和B组分的质量之比为1：(0.2-1.2)。本发明的环氧树脂封装胶具有耐高温高湿的优良特性，并保留了良好的机械性能，可作为LED封装胶。

The invention discloses an epoxy resin packaging adhesive, including component A and component B; The A component comprises the following components: epoxy resin, antioxidant, accelerator A, filler and modified laminated silicates; The B component comprises the following components: anhydride, accelerator B and coupling agent; The optimal mass ratio of component A and component B is 1：(0.2-1.2). The epoxy resin packaging adhesive of the invention has the excellent characteristics of high temperature resistance and high humidity, and retains good mechanical properties, and can be used as LED packaging adhesive.