本发明提供一种导热有机硅粘合剂，通过加入具有烯基、环烷基环氧基和二环烷基硅氧链节的特定支链型有机聚硅氧烷，能够使导热有机硅粘合剂在保持良好导热性的同时，获得改善的对LED芯片的粘合强度(尤其是高温粘合强度)和气体阻隔性。此外，本发明还公开了由所述导热有机硅粘合剂固化形成的固化物，以及包含被所述固化物粘合的LED芯片的LED元件。

The present invention provides a thermal conductive silicone adhesive, by joining with alkenyl, naphthenic base epoxy and on the specific branched alkyl silica link type organic polysiloxane, can make the thermal conductive silicone adhesive while maintaining good thermal conductivity, improve the LED chip (especially high temperature bonding strength) of the adhesive strength and the gas barrier property. In addition, the invention discloses a cured substance formed by curing of the thermally conductive silicone adhesive and an LED component comprising an LED chip bonded by the cured substance.