本发明涉及一种导热有机硅粘合剂，包括：(A)具有至少两个与硅原子键合的烯基的直链型有机聚硅氧烷；(B)具有至少两个与硅原子键合的氢原子的直链型有机氢聚硅氧烷；(C)如式(1)：(R¹SiO_3/2 )_a( R²SiO_3/2)_b所示的有机聚倍半硅氧烷，式( 1 )中，R¹选自烯基，R²选自含有环氧基的一价有机基团，0.1≤a≤0.9，0.1≤b≤0.9，且a+b＝1；(D)导热填料；(E)铂系催化剂；以及( F)反应抑制剂。通过各组分之间的配合，赋予了粘合剂良好的粘合性能和加工性能。

The invention relates to A thermal silicone adhesive comprising :(A) straight chain organopolysiloxane having at least two alkenes bonded to silicon atoms; (B) straight chain organohydropolysiloxane having at least two hydrogen atoms bonded to silicon atoms; (C) organopolysiloxane as shown in formula (1) :(R¹SiO_3/2)_a(R²SiO_3/2)_b. In formula (1), R¹ is selected from the alkene group, R² is selected from the monovalent organic group containing the epoxy group,0.1≤a≤0.9，0.1≤b≤0.9 (D) Thermal conductivity packing; (E) Platinum catalyst; And (F) response inhibitors. Through the coordination of various components, the adhesive is endowed with good adhesion and processing properties.