本发明公开了一种倒装LED芯片，所使用的衬底为分布有荧光颗粒的荧光陶瓷衬底，并在荧光陶瓷衬底的第一表面依次设置有n型外延层、发光层以及p型外延层，并形成倒装LED芯片的结构。发光层所产生的部分光线可以射入上述荧光陶瓷衬底，从而激发荧光陶瓷衬底中的荧光颗粒产生相应颜色的光线，有荧光颗粒所产生的光线可以与发光层所产生并透过荧光陶瓷衬底的光线互补从而产生预设颜色的光线，从而可以避免在倒装LED芯片的发光表面覆盖荧光胶。避免设置荧光胶可以有效增加倒装LED芯片的耐热性，从而有效增加LED器件的可靠性以及使用寿命。本发明还提供了一种倒装LED芯片的制备方法，所制备的倒装LED芯片同样具有上述有益效果。

The invention discloses a flip LED chip, the substrate used is a fluorescent ceramic substrate with fluorescent particles distributed, and the first surface of the fluorescent ceramic substrate is successively provided with n-type epitaxial layer, luminescent layer and P-type epitaxial layer, and forms the structure of the flip LED chip. Part of the light generated by the luminescent layer can be emitted into the fluorescent ceramic substrate, so as to excite the fluorescent particles in the fluorescent ceramic substrate to produce the corresponding color light. The light generated by the fluorescent particles can be complementary with the light generated by the luminescent layer and through the fluorescent ceramic substrate to produce the preset color light. Thus, it can avoid covering fluorescent adhesive on the luminous surface of flip LED chip. Avoiding setting fluorescent glue can effectively increase the heat resistance of flip LED chip, thus effectively increasing the reliability and service life of LED devices. The invention also provides a preparation method of flip LED chip, and the flip LED chip prepared has the same beneficial effect.