分析测试报告 |
连铸态扫描组织 |
Scanning microstructure of continuous casting state |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后RZ-GR980-0.5H扫描组织 |
Scanning microstructure of RZ-GR980-0.5H after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后RZ-GR980-1H扫描组织 |
Scanning microstructure of RZ-GR980-1h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后RZ-GR980-2H扫描组织 |
Scanning microstructure of RZ-GR980-2h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后固溶980℃0.5h扫描组织 |
Scanning microstructure after solid solution at 980℃ for 0.5h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后固溶980℃1h扫描组织 |
Scanning microstructure after solid solution at 980℃ for 1h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后固溶900℃4h扫描组织 |
Scanning microstructure after solid solution at 900℃ for 4h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后固溶940℃4h扫描组织 |
Scanning microstructure after solid solution at 940℃ for 4h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后固溶1020℃1h扫描组织 |
Scanning microstructure after solid solution at 1020℃ for 1h after continuous casting. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸后一次冷轧70%显微组织 |
Microstructure of 70% cold rolled after continuous casting |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |