分析测试报告 |
热轧后980℃固溶12h光学金相 |
Optical metallography after hot rolling at 980℃ for 12h. |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效0.5h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 0.5h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效1h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 1h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效3h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 3h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效6h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 6h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效12h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 12h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效15min光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 15min |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧后980℃固溶2h+500℃时效24h光学金相 |
Optical metallography after hot rolling at 980℃ for 2h and aging at 500℃ for 24h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
热轧+固溶980℃12h+时效24h的光学金相 |
Optical Metallography of Hot Rolling+Solution at 980℃ for 12h+Aging for 24h |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |
分析测试报告 |
连铸态扫描组织 |
Scanning microstructure of continuous casting state |
高端集成电路关键材料Cu-Ni-Si合金带材短流程低成本生产关键技术开发与应用 |
2023-04-02 |