采用真空感应熔炼制备两种材料电极棒毛坯，根据图纸要求加工成要求尺寸的电极棒，再分别采用无坩埚气雾化和等离子旋转电极雾化制备S590和K390粉末。制备的S590和K390粉末主要呈规则的球形，也有少部分为近球形，其中PREP粉末球形度和表面光洁度更高，EIGA粉末表面更加的粗糙，并且存在少量卫星粉。K390 PREP的D50为77.73 μm，而K390 EIGA的中值粒径D50为37.54 μm，同样的S590 PREP的D50为107.33 μm，S590 EIGA的D50为39.20 μm，可以看出PREP粉末平均粒度比EIGA粉末要大。K390 PREP的粉末分布范围30-180 μm，而K390 EIGA的粉末分布范围3.8-158 μm，S590 PREP 粉末集中分布在26-208 μm和208-954 μm之间，S590 EIGA粉末则分布在5-181 μm之间。

The blank of electrode rod of two kinds of materials is prepared by vacuum induction melting, and the electrode rod of required size is processed according to the drawing requirements, and then S590 and K390 powders are prepared by using non-crucible gas atomization and plasma rotating electrode atomization respectively. The prepared S590 and K390 powders are mainly regular spherical, and some are near-spherical, in which PREP powder has higher sphericity and surface finish, EIGA powder has more rough surface, and there is a small amount of satellite powder. D50 of K390 PREP is 77.73 μ m. The median particle size D50 of K390 EIGA is 37.54 μ m. D50 of the same S590 PREP is 107.33 μ m. D50 of S590 EIGA is 39.20 μ m. It can be seen that the average particle size of PREP powder is larger than that of EIGA powder. K390 PREP powder distribution range 30-180 μ m. The powder distribution range of K390 EIGA is 3.8-158 μ m. S590 PREP powder is concentrated in 26-208 μ M and 208-954 μ M, S590 EIGA powder is distributed in 5-181 μ M.