该图为切割区和焊接区基体有效晶粒尺寸,切割区有效晶粒尺寸为6.9μm,焊接区有效晶粒尺寸为5.6μm。
The figure shows the effective grain size of the matrix in the cutting area and welding area, and the effective grain size in the cutting area is 6.9 μ m. The effective grain size of the welding zone is 5.6 μ m。