图2.45(a)所示，BAl88Si药芯钎料具有较宽的熔化温度范围，当钎料开始熔化时起始温度为585℃，所有钎料熔化完的终止温度为620℃，峰值对应的温度为601℃在上述实验结果的基础上，分别在Cu、Al板上测定钎料的润湿性。从图2.45(b)可以看出，随着温度的升高，钎料在铜板和铝板上的铺展面积呈先增加后下降又上升的趋势。

As shown in Figure 2.45(a), the BAl88Si flux cored solder has a wide melting temperature range. When the solder starts to melt, the starting temperature is 585℃, and the termination temperature of all solders is 620℃, and the peak temperature corresponds to the temperature. At 601°C, on the basis of the above experimental results, the wettability of the solder was measured on the Cu and Al plates respectively. It can be seen from Figure 2.45(b) that as the temperature increases, the spreading area of ​​the solder on the copper and aluminum plates first increases, then decreases and then rises.