650℃退火1小时分布于晶内的脆性化合物重新溶入固溶体内，但随着退火时间的延长，在晶内又开始析出颗粒状脆性化合物，导致焊片强度和塑性发生变化，影响下一道工序生产，因此将退火温度设定在650℃，1个小时到1.5小时，满足后续工艺要求。

The brittle compounds distributed in the crystal after annealing at 650°C for 1 hour re-dissolve into the solid solution, but with the extension of the annealing time, granular brittle compounds begin to precipitate in the crystal, resulting in changes in the strength and plasticity of the solder sheet, affecting the next process For production, the annealing temperature is set at 650°C for 1 hour to 1.5 hours to meet the subsequent process requirements.