以高纯钨粉为原料，通过等静压和烧结成型，烧结温度2300℃，然后再在轧机上进行轧制，分别制备出3-11mm超高纯钨板。不同厚度钨板制备完成后，分别线切割取样10*10*T（避开边缘20mm），然后六面磨光，超声波清洗烘干后，在虹鹭自有梅特勒电子天平XS105DU上进行密度检测，参照标准：GB/T 3850。

Using high purity tungsten powder as raw material, 3-11mm ultra-high purity tungsten plates were prepared by isostatic pressing and sintering at 2300℃ and then rolling on a rolling mill. After the tungsten plates of different thickness were prepared, samples of 10*10*T were taken by wire cutting respectively (avoiding the edge 20mm), then the six sides were polished, cleaned and dried by ultrasonic wave, and the density was detected on the Mettler electronic balance XS105DU of Heris with reference to GB/T 3850.