本发明设计了一种高强高导固溶强化Cu‑Mg‑In系合金及其线材制备工艺。采用机器学习方法优选的高性能铜合金的固溶合金元素In，开发的高强高导固溶强化Cu‑Mg‑In系合金成分特征在于：Mg含量为0.10wt％～0.50wt％，In含量为0.05wt％～0.50wt％，余量为Cu；根据性能调控需要，还可以添加P、Si、Zn、Cr、Ca、Zr、Ti、Sn、Ag或RE中一种或多种微合金化元素，以提升合金的综合力学与导电性能；所制备线材抗拉强度可达550～650MPa，导电率为65％IACS～78％IACS，300℃保温2h处理后合金强度降低＜10％，适合大规模工业化生产与应用。

The present invention designs a high-strength and high conductivity solid solution strengthened Cu-Mg-In alloy and its wire preparation process. The solid solution alloy element In of high-performance copper alloy was optimized using machine learning methods. The developed high-strength and high conductivity solid solution strengthened Cu-Mg-In alloy has the following composition characteristics: Mg content ranges from 0.10wt% to 0.50wt%, In content ranges from 0.05wt% to 0.50wt%, and the remaining amount is Cu; According to performance control requirements, one or more microalloying elements from P, Si, Zn, Cr, Ca, Zr, Ti, Sn, Ag or RE can be added to enhance the comprehensive mechanical and electrical conductivity of the alloy; The tensile strength of the prepared wire can reach 550-650MPa, and the conductivity is between 65% IACS and 78% IACS. After being insulated at 300 ℃ for 2 hours, the alloy strength decreases by less than 10%, making it suitable for large-scale industrial production and application.