一种铜合金板带箔低温去应力张力矫直工艺,工艺流程步骤为:开卷→脱脂→一次刷洗→一次烘干→低温去应力张力矫直→酸洗→二次刷洗→钝化→二次烘干→收卷;本发明采用展开式消除应力退火,消除了材料的部分残余内应力,达到了铜合金材料深加工要求,尤其是能够较好地满足高端框架材料蚀刻、半蚀刻的要求在低温环境下采用“大张力矫直”改善了铜板带箔材的板型,消除了退火前轻微的边浪等板型不良材料消除应力退火后仍保持原状态,同时材料的塑性、电性能得到提升铜带展开通过式退火,避免了退火不均匀现象解决了目前国内铜合金板带箔材深加工对于内应力的要求,尤其是高端框架材料对于半蚀刻的要求,蚀刻后的铜板不出现翘曲和扭曲。
A copper alloy plate, strip and foil low-temperature stress-relieving tension straightening process. The process steps are: uncoiling→degreasing→ primary brushing→primary drying→low-temperature stress-relieving tension straightening→pickling→secondary brushing→passivation→secondary Drying→rewinding; the present invention adopts unfolding stress relief annealing, which eliminates part of the residual internal stress of the material, and meets the requirements for deep processing of copper alloy materials, and especially can better meet the requirements of etching and half etching of high-end frame materials. The use of "large tension straightening" in the environment improves the shape of the copper plate, strip and foil, and eliminates the slight edge waves before annealing and other poor shape materials such as the stress relief and annealing, which will remain in the original state, while the plastic and electrical properties of the material have been improved. The copper strip is expanded through annealing, which avoids the uneven annealing phenomenon and solves the current domestic copper alloy plate, strip and foil deep processing requirements for internal stress, especially the requirements for half-etching of high-end frame materials, and the etched copper plate does not show warpage and distortion.