本发明涉及一种高强度高导电、耐应力松弛铜合金引线框架材料及其制备方法,属于有色金属加工领域。该材料的重量百分比组成为：Ni 3.0-4.0％,P 0.3-0.5％,Si 0.2-0.4％,Sn 0.03-0.1％,Fe 0.5-1％,Co 0.05-0.2％,其余为Cu。通过熔炼及铸造,热轧,粗轧,中间退火,酸洗,中轧,固溶处理,酸洗,精轧,时效处理等加工处理后得到。本发明的引线框架材料的抗拉强度为700–850 MPa,电导率为40-50 ％IACS,延伸率为6-10％,抗应力松弛性能为8-92％,具有高强度高导电、高抗应力松弛特性,可以满足大规模集成电路对中高端引线框架材料的使用要求。

The invention relates to a copper alloy lead frame material with high strength, high conductivity and stress relaxation resistance and a preparation method thereof, belonging to the field of Non–ferrous metal processing. The weight percent composition of the material is: Ni 3.0-4.0%, P 0.3-0.5%, Si 0.2-0.4%, Sn 0.03-0.1%, Fe 0.5-1%, Co 0.05-0.2%, the rest is Cu. By melting and casting, hot rolling, rough rolling, intermediate annealing, pickling, intermediate rolling, solid solution treatment, pickling, finishing rolling, aging treatment and other processing. The lead frame material of the invention has tensile strength of 700-850 MPa, electrical conductivity of 40-50% IACS, elongation of 6-10%, stress relaxation resistance of 88-92%, and high strength, high conductivity and high stress relaxation resistance, the utility model can meet the application requirements of the medium and high end lead frame materials for large scale integrated circuits.