低合金高强钢在不同阴保电位拉伸二次裂纹:a1, a2 , a3为粗晶区;b1, b2 ,b3为母材;a1 , b1为 开路下拉伸,,a2 , b2为-850 mV下拉伸;a3 , b3为 -1200 mV 下拉伸。
IPF of secondary cracks on the SSRT fracture side faces of CGHAZ (a1, a2 and a3) and BM (b1, b2 and b3) at the OCP (a1 and b1), -850 mV (a2 and b2) and -1200 mV (a3 and b3).