药芯钎料火焰钎焊Cu/Al接头的显微组织分析，能谱分析，线扫描分析结果。钎缝中主要是以Zn基固溶体和Al基固溶体为主，钎缝还有少量尺寸较小的CuAl₂(见B点能谱)相分布其中。铜侧界面组织与其他钎料钎焊时的情况相似，生成物依然是Cu_3.2Al_4.2Zn_0.7相，但其形貌变小。

The microstructure, energy spectrum and line scanning analysis of flame brazing cu/al joint of flux core solder. The main distribution of the solder joints is Zn based solid solution and Al based solid solution, and there are a few cubl2 (see energy spectrum of point B) with smaller size. The microstructure of copper side interface is similar to that of the other, and the product is cu3.2al4.2zn0.7, but its morphology is smaller.