Cu元素扩散程度明显高于Al元素,且Al、Cu元素按一定比例呈阶梯状分布,在线扫描结果中共有两个阶梯,这也再次印证在Cu侧钎缝界面共有两种金属间化合物生成。
The diffusion degree of Cu element is significantly higher than that of Al element, and Al and Cu elements are distributed stepwise in a certain proportion. There are two steps in the online scanning results, which again proves that there are two intermetallic compounds formed at the Cu side brazing interface.