图2.89为CuP钎料钎焊接头腐蚀试验前后微观组织，盐雾腐蚀之后，钎料的微观组织无变化，但钎料的表层有一层腐蚀坑，如红色箭头所示，腐蚀产物基本已脱落。

Figure 2.89 shows the microstructure before and after the corrosion test of the CuP solder brazed joint. After salt spray corrosion, the microstructure of the solder has no change, but there is a layer of corrosion pits on the surface of the solder. As shown by the red arrow, the corrosion products have basically fallen off.