CsF-AlF3钎剂之所以有很高的钎焊活性，高温下HF的产生及其与氧化物的反应是关键因素。这一机制与CsF-AlF₃钎剂类似，都是通过使金属氧化物转变为氟化物，从而使氧化膜发生溶解，从而促进钎料在铝合金母材表面润湿的。熔融钎料在铝合金板上的铺展性能良好，润湿角小于10º，但在纯铜上的铺展性能较差，润湿角大于10º。根据铺展润湿性试验结果，项目初步筛选了Zn-2Al基、Zn-5Al基、Zn-10Al、Zn-15Al、Zn-22Al基五系列中五种钎料（序号4、7、9、11、13）进行下一阶段的Cu/Al接头组织与性能试验和Cu/Al接头耐腐蚀性能研究。

The reason why CsF-AlF3 flux has high brazing activity is the production of HF at high temperature and its reaction with oxides. This mechanism is similar to that of CsF-AlF3 flux, which converts metal oxides into fluorides, thereby dissolving the oxide film, thereby promoting the wetting of the brazing filler metal on the surface of the aluminum alloy base material. The spreading performance of molten brazing filler metals on aluminum alloy plates is good, with a wetting angle of less than 10º, but the spreading performance on pure copper is poor, with a wetting angle greater than 10º. According to the results of the spreading wettability test, the project initially screened five solders in the five series of Zn-2Al-based, Zn-5Al-based, Zn-10Al, Zn-15Al, and Zn-22Al-based (serial numbers 4, 7, 9, 11). , 13) Carry out the next stage of Cu/Al joint structure and performance test and Cu/Al joint corrosion resistance research.