一种高强高弹铜镍硅钴系引线框架加工工艺,工艺流程步骤为熔炼→加热→热轧→固溶→铣面→初轧→一次退火→中轧→二次退火→精轧→时效处理；本发明通过在Cu-Ni-Si-Co合金中加入Mg、Ce或其他稀土元素或Al或Cr或Ti或Zr或P或Ag或Fe或Zn利用材料固溶时效处理时，Ni与Si形成Ni₂Si相，Co与Si形成Co₂Si相，而基体为Cu,使合金在起到强化作用的同时还能保持高的导电性；通过添加能细化晶粒的金属元素；提高合金的强化作用；使带材性能达到屈服强度800-850 MPa、弹性模量≥125 GPa、导电率≥45% IACS、室温下100 h应力松弛≤5%，满足大规模、极大规模集成电路高密度引线框架端子和高端电子元器件精密接插端子对铜合金材料的使用要求。

A high-strength and high-elastic copper-nickel-silicon-cobalt lead frame processing technology. The process flow steps are smelting→heating→hot rolling→ solid solution→milling→blooming→primary annealing→intermediate rolling→secondary annealing→finishing rolling→aging treatment The present invention adds Mg, Ce or other rare earth elements or Al or Cr or Ti or Zr or P or Ag or Fe or Zn to the Cu-Ni-Si-Co alloy when the material is solid-solution aging treatment, Ni and Si are formed Ni₂Si phase, Co and Si form a Co₂Si phase, and the matrix is Cu, so that the alloy can be strengthened while maintaining high conductivity; by adding metal elements that can refine the grains, the strengthening effect of the alloy is improved, so that The strip performance can reach yield strength 800-850 MPa, elastic modulus ≥125 GPa, conductivity ≥45% IACS, 100 h stress relaxation at room temperature ≤5%, meeting the requirements of large-scale, very large-scale integrated circuit high-density lead frame terminals and high-end electronic components The requirements for the use of copper alloy materials for the precision plug-in terminals of the device.